Keep theĬircuit Board Foil Repair Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500。 F to 600。 F. Some solder removal devices not classified as "antistatic" can generate electrical charges sufficient to damage ES Unless specified otherwise in this service manual, clean electrical contacts only by applying the following mixture to -static type solder removal device. Please use only a plastic screwdriver to protect yourself from shock hazard during service operation. These parts are marked on the schematic diagram
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